EEN 613
Electronic System Packaging and PCB Design
Electrical Engineering · Faculty of Engineering · 3 credits
Description
Introduction to System-on-Package (SOP) technology. Introduction to System-on-Chip (SOC). Stacked ICs and Packages (SIP). Mixed-Signal (SOP) design. Radio Frequency System-on-Package (RF SOP). Printed circuit technology drivers. PCB materials. PCB engineering and design.