# EEN 613 — Electronic System Packaging and PCB Design (NDU)

> EEN 613 Electronic System Packaging and PCB Design at Notre Dame University – Louaize. no student contributions yet.

Source: https://studiety.com/ndu/course/3604
Retrieved: 2026-08-03

## Facts

- Course code: EEN 613
- Title: Electronic System Packaging and PCB Design
- University: Notre Dame University – Louaize (NDU)
- Subject: Electrical Engineering
- Faculty: Faculty of Engineering
- Credits: 3

## Catalogue description

Introduction to System-on-Package (SOP) technology. Introduction to System-on-Chip (SOC). Stacked ICs and Packages (SIP). Mixed-Signal (SOP) design. Radio Frequency System-on-Package (RF SOP). Printed circuit technology drivers. PCB materials. PCB engineering and design.

## Quick answers

### What is EEN 613 at NDU?

EEN 613 Electronic System Packaging and PCB Design is a 3-credit course at Notre Dame University – Louaize (NDU), in the Faculty of Engineering. Introduction to System-on-Package (SOP) technology. Introduction to System-on-Chip (SOC). Stacked ICs and Packages (SIP). Mixed-Signal (SOP) design. Radio Frequency System-on-Package (RF SOP). Printed circuit technology drivers. PCB materials. PCB engineering and design.

### How many credits is EEN 613?

EEN 613 Electronic System Packaging and PCB Design is worth 3 credits at NDU.

## See also

- [All Electrical Engineering courses at NDU](https://studiety.com/ndu/subject/electrical-engineering.md)
- [Every NDU subject](https://studiety.com/ndu/subjects.md)

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